Proprietary High Power DPSS Picosecond UV lasers at work.

We are the only company in the world that can:

Drill micro-holes with diameter 10 µm in 1 mm thick glass.
Cut relatively thick glass (up to 2 mm thick) with 10-50 µm wide cuts of any configuration.

Material: Diamond

Cut depth: 1200 µm
Cut wall slope: 6.5 deg.

Material: Laser Crystal @1064nm
Cut depth: 2250 µm
Cut wall slope: 6.6 deg.

Material: Ceramic
Cut depth: 1200 µm
Cut wall slope: 14.8 deg.

Sample materials micro processing using UV short picosecond pulses:

Material: Aluminum
Cut depth: 1200 µm
Cut wall slope: 6.5 deg.

Material: Copper
Cut depth: 900 µm
Cut wall slope: 16.5 deg.

Material: Plexiglass (Polycarbonate)
Cut depth: 4500 µm
Cut wall slope: 2.3 deg.

Material: Glass
Cut depth: 1200 µm
Cut wall slope: 1.5 deg.

Material: Glass
Cut depth: 1200 µm
Cut wall slope: 1.5 deg.

Material: Glass
Cut depth: 950 µm
Cut wall slope: 11.9 deg.

Material: Glass
Material thickness: 1 mm
Hole diameter: 10 µm

Through Vias in Glass
Material thickness: 1 mm
Hole diameter: 10 µm

Material: Zerodur (Sital)
Through Square Cut
Size: 1.0×1.0mm, 0.5mm thick

Material: Copper
Posts Cut in Copper plate
Size: 50 x 50 µm x ~1 mm deep spaced 50 µm apart

Closeup of the posts shown to the left

Material: Aluminum Foil
Slit Cut in Aluminum Foil
Slit Width: 12 um
Foil Thickness: 100 um

Material: Aluminum Foil
Slit Cut in Aluminum Foil
Slit width: 12 um
Foil Thickness: 100 um

Custom drilled pathway through mirror.

Angle = 45 deg.

Channel drilled through a 0.5mm thick alloy plate

Angle = 45 degrees