Features
Up to three times higher pulse energy than the standard Compiler
Additional amplifier stages integrated into the proven Compiler platform
Higher peak power for faster material removal and deeper drilling
Picosecond pulse duration preserved across all wavelength configurations
Available at 1064, 532, 355, 266 and 213 nm
Diffraction-limited TEM₀₀ Gaussian beam
Air or liquid cooling options
Applications
Photomask fabrication and repair
Bio-cell marking
Drilling and cutting of diamonds, polymers, organic materials and crystals
Time-resolved spectroscopy
X-ray tube fabrication
Thin-film deposition
Optical switches
Remote sensing, ranging and LIDAR
High-accuracy global and local positioning
TECHNICAL DATA
Specifications
| Wavelength |
1064 nm |
532 nm |
355 nm |
266 nm |
213 nm |
| Energy output (at 1000 Hz) |
1.5 mJ |
0.8 mJ |
0.4 mJ |
0.2 mJ |
0.15 mJ |
| Pulse width |
8 ps |
7 ps |
6 ps |
5 ps |
5 ps |
| Repetition rate |
Internal/external triggering, 1000* Hz |
| Q-switch |
Passive |
| Beam quality |
Diffraction limited |
| Beam profile |
TEM₀₀ Gaussian |
| Pulse-to-pulse standard deviation |
<3% @1064 nm, optional upon request |
| Output beam pointing stability (std. dev., 1 hour) |
~0.5 diffraction limit |
| External control |
Connector for TTL trigger input port (4 ±1 V, 1 kΩ) |
| Electrical power |
~100–240 VAC, 47–63 Hz, single phase |
| Power consumption |
200 W |
| Warm-up time |
Less than 5 minutes |
| Operating temperature and humidity |
18–28 °C; 10–85% |
* Request Compiler Upgrade 400 (400 Hz repetition rate) for higher energy per pulse.
Delivery set
Laser head
Power unit
Optical fiber
Signal cable
Power cord
Manual and control software
Additional information
Compiler Upgrade 400 is available at 400 Hz for higher pulse energy.