Features
8 ps pulse width at 1064 nm
More than 65 µJ per pulse at 1064 nm
14 kHz repetition rate
TEM₀₀ beam quality
Water cooling; air cooling optional
External triggering or computer control, including burst mode
Custom upgrade to 100 µJ at 1064 nm and 20 kHz
Applications
Micromachining of wafers, solar panels, glass and metals
Photomask fabrication and repair
UV and time-resolved spectrometry
Single- and two-photon LIF
Distant and remote sensing
Laser ablation, fragmentation and destruction
Medical and biomedical research
TECHNICAL DATA
Specifications
| Wavelength |
1064 nm |
532 nm |
355 nm (optional) |
266 nm (optional) |
| Energy output (at 12 kHz) |
200 µJ |
100 µJ |
35 µJ |
20 µJ |
| Pulse width |
8 ps |
7 ps |
6 ps |
5 ps |
| Repetition rate |
12 kHz, fixed at factory |
| Q-switch |
Passive |
| Beam quality |
Diffraction limited |
| Beam profile |
TEM₀₀ Gaussian |
| Pulse-to-pulse standard deviation |
3% @1064 nm, optional upon request |
| Output beam pointing stability (std. dev., 1 hour) |
~0.5 diffraction limit |
| External control |
Connector for TTL trigger input port (4 ±1 V, 1 kΩ) |
| Electrical power |
~100–240 VAC, 47–63 Hz, single phase |
| Power consumption |
< 300 W |
| Warm-up time |
Less than 5 minutes |
| Operating temperature and humidity |
18–25 °C; 10–85% |
* Request Compiler HPRR Upgrade for a more powerful output.